This product is refined by a shell mold, high temperature materials High pressure injection from corrosion, RF card chip inside the package by filling epoxy resin, a combination of ultrasonic welding.
Suitable for access control, public transportation, parking, authentication, time and attendance management, ticket, card payment, product identification.
Can be packaged chip:
TK4100, ATA5567, MIFARE 1 13.56Mhz, MIFARE 1 S70, Ultralight, I-CODE SLI
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Block 4 West, SEG Technology Park, Hua Qiang Road North, Shenzhen, China